Shannon Davis / Solid State Technology
Henkel Unveils Semiconductor Capillary Underfill for Advanced Silicon Node Flip Chip Applications – Henkel today announced the commercialization of its latest semiconductor-grade capillary underfill (CUF) formulation for advanced packaging applications. Henkel Unveils Semiconductor Capillary Underfill for Advanced Silicon Node Flip Chip Applications was posted by Shannon Davis on Semiconductor Digest. Loctite Eccobond UF 9000AG breaks past conventional formulation paradigms, balancing high filler loading …
