DIGITIMES / DigiTimes: IT news from Asia
Challenges for semiconductor sector (6): The value of back-end business – Advanced packaging technology has become a powerful tool for TSMC to grab orders for advanced chips. Now Samsung Electronics has also announced that it will strengthen its back-end packaging and testing technology. As for the top 10 makers in the packaging and testing industry, their revenue in 2021 reached US$33.7 …
