Jack Purcher / Patently Apple
Apple Supplier TSMC announced 3nm chips with Revolutionary ‘FinFlex’ Architectural Innovation, 2nm C – Late yesterday TSMC showcased the newest innovations in its advanced logic, specialty, and 3D IC technologies at the Companys 2022 North America Technology Symposium, with the next-generation leading-edge N2 process powered by nanosheet transistors and the unique FINFLEX technology for the N3 and N3E processes making their debut. …
