Willy Shih, Senior Contributor / Forbes Business News
Intel’s Ponte Vecchio And AMD’s Zen 3 Show The Promise Of Advanced Semiconductor Packaging Technolog – Intel and AMD discussed some of their most advanced chip designs at the International Solid State Circuits conference this week, and they highlighted the role that advanced packaging plays in their future high end products.Intel and AMD discussed some of their most advanced chip designs at the International Solid State …
