Willis Ke / DigiTimes: IT news from Asia
Substrate-free FOPLP technology gaining ground in advanced packaging market – Chip demand for 5G, AI, and automotive applications continues to grow robustly, but substrates needed to process related chips will remain in short supply until at least 2025, which will accelerate the entry of substrate-free fan-out (FO) backend solutions, such as FOPLP ( panel level package), into the advanced packaging …
