Willis Ke / DigiTimes: IT news from Asia
TSMC may triple CoWoS material purchases for Nvidia new HPC chips – Nvidia is set to launch new HPC GPU platforms for datacenter, AI and gaming applications in 2022, and its manufacturing partner TSMC reportedly is expected to triple order placements with suppliers of packaging substrates and thermal materials needed to support massive CoWoS (chip on wafer on substrate) packaging of the …
