Willis Ke / DigiTimes: IT news from Asia
TSMC, Unimicron to offer production solutions for Apple M1 Ultra – Apple has just unveiled its M1 Ultra SoC built using in-house-developed UltraFusion packaging architecture, which will be fabricated by TSMC with a 5nm process node and advanced packaging technology, with the required ABF substrates to be solely supplied by Unimicron Technology, according to industry sources. …
