Toshiba to Expand Power Semiconductor Production Capacity With 300-Millimeter Wafer Fabrication Faci (Shannon Davis/Solid State Technology)

Shannon Davis / Solid State Technology
Toshiba to Expand Power Semiconductor Production Capacity With 300-Millimeter Wafer Fabrication Faci – Toshiba Electronic Devices Storage Corporation today announced that it will construct a new 300-milimeter wafer fabrication facility for power semiconductors at its main discrete semiconductor production base, Kaga Toshiba Electronics Corporation, in Ishikawa Prefecture. Toshiba to Expand Power Semiconductor Production Capacity With 300-Millimeter Wafer Fabrication Facility was posted by …

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