Kevin Cheng / DigiTimes: IT news from Asia
Taiwan backend houses step up deployments for 3rd-gen semiconductors – GEM Services and Lingsen Precision Industries, which specialize in power component and module backend services, and RF component and module packagers Tong Hsing Electronic Industries and Chipbond Technology have all deepened their deployments in the third-generation semiconductor field by stepping up their purchases of related high-precision equipment and facilities, according …
