EMC to issue bonds for capacity expansion on IC substrate CCLs (Willis Ke/DigiTimes: IT news from Asia)

Willis Ke / DigiTimes: IT news from Asia
EMC to issue bonds for capacity expansion on IC substrate CCLs – Taiwan-based CCL manufacturer Elite Material (EMC) has disclosed plans to issue NT$3.5 billion (US$125.7 million) in convertible corporate bonds to fund its capacity expansion for CCL materials needed in production of IC substrates now in ever-increasing demand, according to industry sources. …

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