DNP Develops Interposer, a Primary Component in Next-Generation Semiconductor Packaging (Shannon Davis/Solid State Technology)

Shannon Davis / Solid State Technology
DNP Develops Interposer, a Primary Component in Next-Generation Semiconductor Packaging – Dai Nippon Printing Co., Ltd. has developed an interposer, a high-performance intermediate device that electrically connects multiple chips and substrates. DNP Develops Interposer, a Primary Component in Next-Generation Semiconductor Packaging was posted by Shannon Davis on Semiconductor Digest. Dai Nippon Printing Co., Ltd. (DNP, TOKYO:7912) has developed an interposer, a …

Leave a Reply

Your email address will not be published. Required fields are marked *

Subscribe to our Newsletter