Shannon Davis / Solid State Technology
EV Group Introduces NanoCleave Layer Release Technology – IR laser cleave technology enables nanometer-precision layer transfer through silicon, eliminating glass substrates for advanced packaging and enabling thin-layer 3D stacking EV Group Introduces NanoCleave Layer Release Technology was posted by Shannon Davis on Semiconductor Digest. EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, …
